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Hot Press Machine — ACF/FPC Pulse Bonding Machine
Jiutu 9TU-M039A Hot Press Machine uses pulse heating and ACF glue process to bond chips, FPC, and FFC cables. Temperature range 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera system. Used in mobile phone cable binding, medical, and R&D applications.
Main Features:
● Pulse heating with constant temperature control
● 45# steel main structure — high precision and stability
● Japanese SMC cylinder + precision pressure regulating valve
● Imported thermal insulation module and tungsten steel cutter head
● HD auxiliary alignment camera system
● Platform pre-heating function
| P/N | 9TU-M039A |
| Heating Method | Pulse heating |
| Working Temperature | 0°C to 500°C |
| Rated Power | 2500W |
| Machine Size | 64×55×57 cm |
| Net Weight | 85 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What is the ACF bonding process and how does this Hot Press Machine use it?
A: ACF (Anisotropic Conductive Film) bonding uses conductive particles embedded in adhesive film to create electrical connections between chips, FPC (Flexible Printed Circuits), or FFC cables and display panels. The Jiutu Hot Press Machine applies precise temperature (0–500°C) and pressure (0–0.6 MPa) to hot-press and burst the ACF particles, achieving vertical electrical conduction while maintaining horizontal non-conduction for reliable, precise connections.
Q2: Can the cutter head of the Hot Press Machine be customized for different FPC sizes?
A: Yes. The cutter head of the Jiutu Hot Press Machine can be customized within 90mm length × 5mm width to match different FPC and FFC cable sizes. The camera alignment system can also be positioned up or down and configured with different lens magnifications based on customer samples, ensuring precise alignment for various component sizes.