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Hot Pressing Machine — Vacuum Thermocompression Bonding Machine
Jiutu 9TU-M048A Hot Pressing Machine is a microfluidic chip vacuum thermocompression bonding machine. Uses temperature and pressure control to bond rigid plastic chips (PMMA, PC, PP, COP, COC, BOPET, etc.) in minutes. Maximum temperature 200°C, maximum pressure 10KN.
Function: Vacuum hot press bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding under vacuum or gas atmosphere.
Applications: Bonding of PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chips. Flexdym polymer molding in as little as 2 minutes.
| P/N | 9TU-M048A |
| Lamination Size | 250×250 mm |
| Working Temperature | 10°C to 60°C |
| Working Humidity | 40%–95% RH |
| Rated Power | 3800W |
| Machine Size | 50×50×93 cm |
| Net Weight | 160 kg |
| Working Pressure | 4–6 kgf/cm² / 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What materials can the Hot Pressing Machine bond?
A: The Jiutu Hot Pressing Machine is mainly suitable for bonding rigid plastic chips including PMMA, PC, PP, COP, COC, BOPET, CBC, resin (partial), and polyethylene (partial). It can also mold Flexdym polymer in as little as 2 minutes and process various other thermoplastics such as acrylic. The maximum temperature is 200°C and maximum pressure is 10KN.
Q2: Why is vacuum used in the Hot Pressing Machine bonding process?
A: The vacuum environment in the Hot Pressing Machine eliminates air bubbles and oxidation during the bonding process. Under vacuum, resistance heating and cylinder pressure cause solid particles to bond at high temperature, reducing voids and grain boundaries. This results in a dense, high-quality bond with significantly improved density, hardness, and mechanical-thermal properties compared to non-vacuum bonding.