Skip to content
Chip Bonding Machine — ACF Pulse Hot Press Bonder
Jiutu 9TU-M039A Chip Bonding Machine uses ACF glue process with pulse heating to bond chips, FPC, and FFC cables. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Suitable for mobile phone chip bonding, medical devices, and R&D applications.
Main Features:
● Pulse heating — precise temperature control for chip bonding
● 45# steel main structure — high precision and stability
● Japanese SMC cylinder + precision pressure regulating valve
● Imported thermal insulation module and tungsten steel cutter head
● HD auxiliary alignment camera system
● Platform pre-heating function
| P/N | 9TU-M039A |
| Heating Method | Pulse heating |
| Working Temperature | 0°C to 500°C |
| Rated Power | 2500W |
| Machine Size | 64×55×57 cm |
| Net Weight | 85 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What is the working principle of the Chip Bonding Machine?
A: The Jiutu Chip Bonding Machine uses the ACF (Anisotropic Conductive Film) glue process. The machine applies precise temperature and pressure to hot-press and burst the ACF conductive particles between the chip and the substrate. This achieves vertical electrical conduction (connecting the chip to the circuit) while maintaining horizontal non-conduction (preventing short circuits between adjacent contacts), creating reliable, high-density chip connections.
Q2: Is the Chip Bonding Machine suitable for bonding display driver chips on mobile phones?
A: Yes. The Jiutu Chip Bonding Machine is specifically designed for mobile phone cable and chip binding applications, including display driver chip bonding, FPC connector bonding, and FFC cable attachment. The cutter head can be customized up to 90×5mm to match different chip and connector sizes, and the HD camera alignment system ensures precise positioning for every bonding operation.