Press Bonding Machine for hard glass TFT OLED IC COF Flexible Display IC, PFC Cable, PCB Board FPC Cable ACF Process Pressing
Power |
AC220V 50HZ |
Equipment power |
1.5KW |
Indenter material |
Tungsten steel |
Pressure head specifications |
customizable |
Pressure accuracy |
0.001Mpa |
Working air source |
0.5MPa—0.6MPa |
Air supply pressure |
4-6Kgf/cm² |
Heating method |
Constant temperature heating |
Temperature feedback |
K type thermocouple |
Pressure head temperature range |
Normal temperature -400℃ (can be set) |
Platform temperature range |
Normal temperature -80℃ (can be set) |
Productivity |
20S/PCS (depending on ACF parameters) |
time setting |
0.1~99.0S |
Process flow |
1) When the device is powered on, the device enters the automatic interface and returns to the origin; |
2) Place the product on the platform and turn on the vacuum, |
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3) Press the vacuum + start button to start the equipment to automatically carry out the pressure. |
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4) After the pressing time is up, the pressure head rises and the tape winding is completed; |
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5) The operator takes out the pressed product; |
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6) Repeat actions 2)~5) to produce the next product; |