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Press Soldering Machine — Vacuum Thermocompression Bonder
Jiutu 9TU-M048A Press Soldering Machine uses vacuum thermocompression technology for precision soldering and bonding of rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN.
Function: Vacuum hot press soldering for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.
Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel soldering and bonding.
| P/N | 9TU-M048A |
| Lamination Size | 250×250 mm |
| Working Temperature | 10°C to 60°C |
| Working Humidity | 40%–95% RH |
| Rated Power | 3800W |
| Machine Size | 50×50×93 cm |
| Net Weight | 160 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What is the difference between the Press Soldering Machine and a standard soldering iron?
A: The Jiutu Press Soldering Machine uses vacuum thermocompression technology, applying simultaneous heat, pressure, and vacuum to bond materials. Unlike a standard soldering iron that applies heat to a single point, this machine presses an entire bonding area (up to 250×250mm) uniformly under vacuum, resulting in a stronger, void-free bond with consistent quality across the entire surface.
Q2: Is the Press Soldering Machine suitable for FPC (Flexible Printed Circuit) bonding?
A: Yes. The Jiutu Press Soldering Machine is suitable for FPC bonding and other precision electronic component bonding applications. The precise temperature control (up to 200°C) and pressure control (0.4–0.8 MPa) make it ideal for bonding flexible circuits, display connectors, and other sensitive electronic components that require controlled thermocompression bonding.