• Jiutu 9TU-M039A ACF Bonding Machine with pulse heating and HD alignment camera for bonding FPC and FFC cables to display panels
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
  • ACF Bonding Machine
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
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JiuTu Machine

ACF limningsmaskine

ACF limningsmaskine

$4,850.00 USD
$4,850.00 USD $4,850.00 USD
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ACF Bonding Machine – FPC/FFC Puls Varmepressebonder

Jiutu 9TU-M039A ACF Bonding Machine anvender ACF (Anisotropic Conductive Film) limproces med pulsvarmetilførsel for at binde chips, FPC og FFC-kabler til displaypaneler. Temperatur 0–500 °C, tryk 0–0,6 MPa. Fræsehoved kan tilpasses op til 90×5 mm. HD justeringskamera. Anvendes inden for mobiltelefonreparation, medicinsk og forsknings- og udviklingsområder.

Hovedfunktioner:

● Pulsvarmetilførsel – præcis temperaturkontrol til ACF-binding

● Hovedstruktur i 45# stål – høj præcision og stabilitet

● Japansk SMC-cylinder + præcisionstrykreguleringsventil

● Importeret varmeisoleringsmodul og fræsehoved i wolframstål

● HD hjælpekamerasystem til justering

● Platformens forvarmningsfunktion

P/N 9TU-M039A
Opvarmningsmetode Pulsvarmetilførsel
Arbejdstemperatur 0°C til 500°C
Nominel effekt 2500W
Maskinstørrelse 64×55×57 cm
Nettovægt 85 kg
Arbejdstryk 0,4–0,8 MPa
Spænding 220V 50Hz

Ofte stillede spørgsmål

Q1: Hvilke typer kabler og stik kan ACF Bonding Machine binde?

A: Jiutu ACF Bonding Machine er designet til at binde FPC (Flexible Printed Circuit) kabler, FFC (Flat Flexible Cable) kabler og chips til displaypaneler og printkort ved hjælp af ACF (Anisotropic Conductive Film). Den bruges bredt i binding af mobiltelefondisplaykabler, binding af tabletskærmstik, samling af medicinsk udstyr og laboratorie-R&D-testapplikationer.

Q2: Hvordan opnår ACF Bonding Machine præcis justering under binding?

A: Jiutu ACF Bonding Machine har et HD hjælpekamerasystem til justering, der kan placeres op eller ned efter behov. Linsens forstørrelse kan konfigureres baseret på kundens prøver. Kombineret med platformens forvarmningsfunktion og japansk SMC-cylinder til præcis trykkontrol, sikrer maskinen nøjagtig, gentagelig justering for hver binding.

Se komplette oplysninger

Frequently Asked Questions

What are the main applications of the ACF Bonding Machine?
The ACF Bonding Machine is widely used in mobile phone repair, medical device assembly, and R&D fields for bonding chips, FPC, and FFC cables to display panels using ACF (Anisotropic Conductive Film).
Can the ACF Bonding Machine accommodate different cable sizes and bonding areas?
Yes, the cutter head of the ACF Bonding Machine is customizable and can be adjusted up to 90×5mm to meet various bonding requirements.
What features ensure the precise bonding and alignment process in the ACF Bonding Machine?
The machine features an HD auxiliary alignment camera system, pulse heating for precise temperature control, and a platform pre-heating function, all contributing to accurate and consistent bonding.
What are the technical specifications of the ACF Bonding Machine?
The machine operates at a temperature range of 0–500°C, with a rated power of 2500W, working pressure of 0.4–0.8 MPa, and dimensions of 64×55×57 cm, weighing 85 kg.
Is the ACF Bonding Machine suitable for use in different industries?
Yes, its features and capabilities make it suitable for use in mobile phone manufacturing, medical device production, and research and development laboratories.