• Jiutu 9TU-M039A Flip Chip Bonding Machine with HD alignment camera and pulse heating system for precise chip bonding
  • Flip Chip Bonding Machine - Phone Repair Tools Machine Parts
  • Flip Chip Bonding Machine - Phone Repair Tools Machine Parts
  • Flip Chip Bonding Machine - Phone Repair Tools Machine Parts
  • Flip Chip Bonding Machine
  • Flip Chip Bonding Machine - Phone Repair Tools Machine Parts
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JiuTu Machine

Flip Chip Bonding Machine

Flip Chip Bonding Machine

$13,300.00 USD
$13,300.00 USD $13,300.00 USD
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Flip Chip Bondingsmaskine — ACF Pulse Hot Press Bonder

Jiutu 9TU-M039A Flip Chip Bondingsmaskine bruger ACF-limproces med pulseopvarmning til at binde flip-chips, FPC- og FFC-kabler til substrater. Temperatur 0-500°C, tryk 0-0,6 MPa. Skærehoved kan tilpasses op til 90×5 mm. HD-justeringskamera. Bruges til binding af mobiltelefonchips, medicinske og F&U-applikationer.

Hovedfunktioner:

● Pulseopvarmning — præcis temperaturkontrol til flip chip-binding

● Hovedstruktur af 45# stål — høj præcision og stabilitet

● Japansk SMC-cylinder + præcisionstrykreguleringsventil

● Importeret varmeisoleringsmodul og tungstenstålskærehoved

● HD hjælpejusteringskamerasystem

● Platform forvarmningsfunktion

P/N 9TU-M039A
Opvarmningsmetode Pulseopvarmning
Arbejdstemperatur 0°C til 500°C
Nominel effekt 2500W
Maskinstørrelse 64×55×57 cm
Nettovægt 85 kg
Arbejdstryk 0,4–0,8 MPa
Spænding 220V 50Hz

Ofte stillede spørgsmål

Q1: Hvad er flip chip-binding, og hvordan understøtter denne maskine det?

A: Flip chip-binding er en metode til at forbinde en halvlederchip direkte til et substrat ved at vende den med forsiden nedad og binde chippens kontaktflader direkte til substratets flader. Jiutu Flip Chip Bonding Machine bruger ACF (Anisotropic Conductive Film) med pulseopvarmning til at skabe pålidelige elektriske forbindelser mellem den vendte chip og substratet. HD-kamerajusteringssystemet sikrer præcis placering af chipkontakterne før binding.

Q2: Hvad er justeringsnøjagtigheden af Flip Chip Bondingsmaskinen?

A: Jiutu Flip Chip Bondingsmaskinen har et HD-hjælpejusteringskamerasystem, der kan placeres op eller ned og konfigureres med forskellige linsestørrelser baseret på kundeprøver. Hovedstrukturen er lavet af 45# stål for høj præcision og stabilitet, og den japanske SMC-cylinder med præcisionstrykreguleringsventil sikrer en ensartet, gentagelig pressestyrke for nøjagtige flip chip-bindingsresultater.

Se komplette oplysninger

Frequently Asked Questions

What industries or applications is the Flip Chip Bonding Machine suitable for?
The Flip Chip Bonding Machine is ideal for mobile phone chip bonding, medical device manufacturing, and R&D applications, providing precise and reliable flip chip connections in various high-tech fields.
How does pulse heating benefit the flip chip bonding process?
Pulse heating allows for precise temperature control during bonding, ensuring high-quality connections and reducing thermal stress on delicate components, which enhances the reliability of the flip chip bonding process.
What are the key features that ensure accuracy and stability in this flip chip bonding machine?
The machine features an HD auxiliary alignment camera, a high-precision 45# steel structure, imported thermal insulation, and a tungsten steel cutter head, all of which contribute to its accuracy, stability, and reliable performance.
Can the cutter head be customized, and what sizes are available?
Yes, the cutter head is customizable and can be up to 90×5mm, allowing adjustments based on specific flip chip bonding requirements.
What are the technical specifications I should know before purchasing the Flip Chip Bonding Machine?
The machine operates at a working temperature of 0–500°C, with a power rating of 2500W, dimensions of 64×55×57 cm, and a net weight of 85 kg. It works at a voltage of 220V 50Hz and uses a pressure of 0.4–0.8 MPa for optimal performance.