• Industrial hot press bonding machine for microfluidic chip bonding and thermoplastic molding
  • Hot Press Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Press Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Press Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Press Bonding Machine
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JiuTu Machine

Hot Press Bonding Machine

Hot Press Bonding Machine

$25,000.00 USD
$25,000.00 USD $25,000.00 USD
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Varmpressebindingsmaskine — Vakuum-termokompression-bonder

Jiutu 9TU-M048A Varmpressebindingsmaskinen bruger vakuum-termokompressionsteknologi til at binde stive plastikchips og termoplastiske materialer. Maksimal temperatur 200°C, maksimalt tryk 10KN. Velegnet til PMMA, PC, PP, COP, COC, BOPET og mere.

Funktion: Vakuum-varmpressebinding til mikrofluidiske enheder, termoplastisk støbning og binding af stive plastikchips. Flexdym polymerstøbning på så lidt som 2 minutter.

Anvendelsesområder: PMMA, PC, PP, COP, COC, BOPET, CBC, harpiks, polyethylen chipbinding; fremstilling af mikrofluidiske enheder; displaypanelbinding.

P/N 9TU-M048A
Lamineringsstørrelse 250×250 mm
Arbejdstemperatur 10°C til 60°C
Arbejdsfugtighed 40%–95% RF
Nominel effekt 3800W
Maskinens størrelse 50×50×93 cm
Nettovægt 160 kg
Arbejdstryk 0,4–0,8 MPa
Spænding 220V 50Hz

Ofte Stillede Spørgsmål

Q1: Hvilke typer plastikchips kan varmpressebindingsmaskinen binde?

A: Jiutu varmpressebindingsmaskinen er velegnet til at binde stive plastikchips, herunder PMMA, PC, PP, COP, COC, BOPET, CBC, harpiks (delvis) og polyethylen (delvis). Den kan også støbe Flexdym-polymer på så lidt som 2 minutter og behandle forskellige andre termoplastmaterialer såsom akryl. Den maksimale bindetemperatur er 200°C med et maksimalt tryk på 10KN.

Q2: Kræver varmpressebindingsmaskinen en ekstern vakuumpumpe?

A: Nej. Jiutu varmpressebindingsmaskinen har et indbygget vakuumsystem. Maskinen bruger modstandsopvarmning kombineret med cylinder tryk under vakuum for at opnå højtydende binding. Arbejdstrykket er 0,4-0,8 MPa (4-6 kgf/cm²), og maskinen drives af en standard 220V 50Hz strømforsyning.

Se komplette oplysninger

Frequently Asked Questions

What materials can I bond using the Hot Press Bonding Machine?
The Hot Press Bonding Machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin, and polyethylene, making it versatile for various microfluidic and thermoplastic applications.
How long does the bonding process typically take with this machine?
The Hot Press Bonding Machine is optimized to make materials like Flexdym polymer molding in just 2 minutes, providing a rapid and efficient bonding process.
What are the operating temperature and pressure ranges for the Hot Press Bonding Machine?
The machine operates at a maximum temperature of 200°C and a maximum pressure of 10KN, allowing precise control for effective bonding of different materials.
Can I use the Hot Press Bonding Machine for vacuum-assisted bonding?
Yes, the vacuum hot press feature allows for bonding under vacuum or with other gases, which enhances the density and quality of the bonds for high-precision applications.
What are the key specifications of the Hot Press Bonding Machine?
This model has a lamination size of 250*250mm, operating temperature of 10°C to 60°C, power of 3800W, and dimensions of 50*50*93 cm, making it suitable for various industrial bonding needs.