• Hot Pressing Bonding Machine for microfluidic chip bonding and thermoplastic molding at high temperature and pressure
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Pressing Bonding Machine
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
1 6

JiuTu Machine

Varmpressende limningsmaskine

Varmpressende limningsmaskine

$28,000.00 USD
$28,000.00 USD $28,000.00 USD
Udsalg Udsolgt
Levering beregnes ved betaling.

Varmpressebindingsmaskine — Vakuum Termokompressionsbonder

Jiutu 9TU-M048A Varmpressebindingsmaskine bruger vakuum-termokompressionsteknologi til at binde stive plastchips og termoplastiske materialer. Maksimal temperatur 200°C, maksimalt tryk 10KN. Velegnet til PMMA, PC, PP, COP, COC, BOPET og mere.

Funktion: Vakuum varmpressebinding til mikrofluidiske enheder, termoplastisk støbning og binding af stive plastchips. Flexdym polymerstøbning på kun 2 minutter.

Anvendelsesområder: PMMA, PC, PP, COP, COC, BOPET, CBC, harpiks, polyethylenchipbinding; fremstilling af mikrofluidiske enheder; displaypanelbinding.

Varenr. 9TU-M048A
Lamineringsstørrelse 250×250 mm
Arbejdstemperatur 10°C til 60°C
Nominel effekt 3800W
Maskinstørrelse 50×50×93 cm
Nettovægt 160 kg
Arbejdstryk 0,4–0,8 MPa
Spænding 220V 50Hz

Ofte stillede spørgsmål

Q1: Kan varmpressebindingsmaskinen binde glas til glas eller glas til plastik?

A: Ja. Jiutu varmpressebindingsmaskinen kan binde glas til glas og glas til plastik ved hjælp af vakuum-termokompression. Den er velegnet til optisk binding af displaydækglas, binding af stive plastchips (PMMA, PC, PP, COP, COC, BOPET) og samling af mikrofluidiske enheder. Vakuummiljøet sikrer en boblefri, højstyrkebinding.

Q2: Hvor lang tid tager en typisk bindingscyklus med varmpressebindingsmaskinen?

A: Bindingscyklustiden afhænger af materialet. For Flexdym-polymer kan maskinen færdiggøre støbningen på så lidt som 2 minutter. For stive plastchips som PMMA og PC tager cyklussen typisk et par minutter, afhængigt af de nødvendige temperatur- og trykindstillinger. Det præcise PLC-kontrolsystem giver operatører mulighed for at programmere og gentage bindingsparametre konsekvent.

Se komplette oplysninger

Frequently Asked Questions

What materials can I bond using the Hot Pressing Bonding Machine?
The Hot Pressing Bonding Machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, and other thermoplastics, ensuring versatile application for various microfluidic device manufacturing needs.
How quickly can I achieve bonding with this machine?
The hot pressing process for materials like Flexdym polymer can be completed in just 2 minutes, making it an efficient tool for rapid microfluidic device fabrication.
What are the temperature and pressure limits of the Hot Pressing Bonding Machine?
The machine operates at a maximum temperature of 200 degrees Celsius and can handle pressures up to 10KN, providing ample range for effective bonding of various thermoplastics.
Is the Hot Pressing Bonding Machine suitable for high-quality microfluidic device production?
Yes, by using advanced temperature and pressure control, along with vacuum or gas assistance, this machine ensures high-density, precise bonding essential for high-quality microfluidic devices.
How does vacuum hot pressing improve material bonding in this machine?
Vacuum hot pressing removes air voids and reduces porosity during bonding, resulting in stronger, more uniform bonds, enhanced density, and improved microstructure of the final product.