• Press soldering machine for microfluidic chip bonding with vacuum thermocompression and temperature pressure control.
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine - Phone Repair Tools Machine Parts
1 7

JiuTu Christin

Tryk loddemaskine

Tryk loddemaskine

$25,000.00 USD
$25,000.00 USD $25,000.00 USD
Udsalg Udsolgt
Levering beregnes ved betaling.

Pressloddemaskine – Vakuum-termokompressionsbonder

Jiutu 9TU-M048A Pressloddemaskine bruger vakuum-termokompressionsteknologi til præcisionslodning og -limning af stive plastchips og termoplastiske materialer. Maksimal temperatur 200°C, maksimalt tryk 10KN.

Funktion: Vakuum varmpresse-lodning til mikrofluidiske enheder, termoplastisk støbning og limning af stive plastchips. Flexdym polymerstøbning på så lidt som 2 minutter.

Anvendelsesmuligheder: PMMA, PC, PP, COP, COC, BOPET, CBC, harpiks, polyethylenchips-limning; fremstilling af mikrofluidiske enheder; lodning og limning af displaypaneler.

P/N 9TU-M048A
Lamineringsstørrelse 250×250 mm
Arbejdstemperatur 10°C til 60°C
Arbejdsfugtighed 40%–95% RF
Nominel effekt 3800W
Maskinstørrelse 50×50×93 cm
Nettovægt 160 kg
Arbejdstryk 0,4–0,8 MPa
Spænding 220V 50Hz

Ofte stillede spørgsmål

Q1: Hvad er forskellen mellem Pressloddemaskinen og en standardloddekolbe?

A: Jiutu Pressloddemaskinen bruger vakuum-termokompressionsteknologi, der anvender samtidig varme, tryk og vakuum til at binde materialer. I modsætning til en standardloddekolbe, der tilfører varme til et enkelt punkt, presser denne maskine et helt limningsområde (op til 250×250 mm) jævnt under vakuum, hvilket resulterer i en stærkere, hulrumsfri binding med ensartet kvalitet over hele overfladen.

Q2: Er Pressloddemaskinen velegnet til FPC (fleksibelt printkort) limning?

A: Ja. Jiutu Pressloddemaskinen er velegnet til FPC-limning og andre præcisionsapplikationer for limning af elektroniske komponenter. Den præcise temperaturstyring (op til 200°C) og trykstyring (0,4–0,8 MPa) gør den ideel til limning af fleksible kredsløb, displaykonnektorer og andre følsomme elektroniske komponenter, der kræver kontrolleret termokompressionslimning.

Se komplette oplysninger

Frequently Asked Questions

What materials can I bond using the Press Soldering Machine?
The Press Soldering Machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, and resin parts, with temperature up to 200°C and pressure of up to 10KN.
How does the Press Soldering Machine enhance microfluidic device manufacturing?
This machine facilitates rapid fabrication of microfluidic devices through temperature and pressure control, allowing bonding within minutes, making it a highly efficient alternative for soft lithography micromachining.
What are the technical specifications of the Press Soldering Machine?
The machine has a lamination size of 250x250mm, a working temperature range from 10°C to 60°C, power consumption of 3800W, and operates at 220V 50Hz with a maximum pressure of 10KN.
Is the Press Soldering Machine suitable for professional laboratory or industrial use?
Yes, it is designed for professional settings, offering precise temperature and pressure control for creating reliable bonds in microfluidic and thermoplastic device manufacturing.
What maintenance or care is required for the Press Soldering Machine?
Routine maintenance includes keeping the work surface clean, inspecting electrical components regularly, and ensuring proper operation of the temperature and pressure controls to maintain optimal performance.