• Jiutu flex bonding machine for phone screen repair
  • flex bonding machine - Phone Repair Tools Machine Parts
  • flex bonding machine
  • flex bonding machine - Phone Repair Tools Machine Parts
  • flex bonding machine - Phone Repair Tools Machine Parts
  • flex bonding machine - Phone Repair Tools Machine Parts
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JiuTu Machine

Jiutu Flex Bonding Machine

Jiutu Flex Bonding Machine

$25,000.00 USD
$25,000.00 USD $25,000.00 USD
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Product Introduction

The flex bonding machine is a professional-grade solution designed to meet the rigorous demands of modern mobile phone repair centers and screen refurbishing workshops. Combining industrial durability with micro-precision control, this equipment ensures high-yield performance, giving repair technicians the edge in display refurbishment and assembly restoration.

Original Specifications and Notes: Frequently Asked Questions Q: What is a flex bonding machine used for in phone repair? A: A flex bonding machine reattaches or bonds flex cables (ribbon cables) to LCD screens and circuit boards using precise heat and pressure, restoring electrical connectivity in damaged displays. Q: What temperature range does it operate at? A: The bonding temperature is adjustable to suit different flex cable adhesive types. Refer to the product specifications for the exact temperature range. Q: Is it compatible with OLED and LCD flex cables? A: Yes, it supports bonding for both LCD and OLED display flex cables across a range of smartphone brands. Q: Does it require vacuum assistance? A: This model uses vacuum lamination to ensure uniform pressure during bonding, eliminating air gaps for a reliable connection. Q: What warranty is included? A: One year warranty with professional technical support provided.

Key Features & Benefits

  • High Precision Bonding: Engineered with optical-grade alignment mechanics to ensure zero bubble and perfect surface lamination.
  • PLC Microcomputer Control: Smart touchscreen interface allows adjustable heating, pressure, and vacuum duration parameters.
  • CE Certified & Safe: Built-in pressure regulators and dual-start buttons for optimal operator safety and device longevity.
  • Wide Material Compatibility: Ideal for OCA, OCF, TPF, PMMA, and other optical adhesive processes on various display panel sizes.

Technical Specifications

Application OCA Gel Bonding / Display Lamination
Control System PLC Touch Screen Controller
Input Voltage AC 110V / 220V Optional
Working Temperature Room Temp to 150°C Adjustable
Est. Cycle Time 20 - 45 Seconds per Cycle
Power Supply AC 110V/220V (Configured for destination country)
Certification CE / FCC Certified

Why Choose Jiutu?

At Jiutu Store, we are committed to providing top-quality phone refurbishing machinery with unmatched B2B support:

  • Expert 1-on-1 Support: Free installation guidance and operational training with our team.
  • Full Factory Warranty: Covered by a comprehensive 12-month factory warranty on main parts.
  • Global Fast Shipping: Safely packed in high-density export wooden crates to prevent shipping damage.
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Frequently Asked Questions

What are the main applications of the flex bonding machine in phone repair?
The flex bonding machine is used to reattach or bond flex cables to LCD screens and circuit boards, restoring electrical connectivity in damaged displays during phone repairs.
Can the flex bonding machine handle different types of display flex cables?
Yes, the flex bonding machine supports bonding for both LCD and OLED display flex cables, making it suitable for a variety of smartphone brands.
What safety features are included with the flex bonding machine?
The flex bonding machine is CE certified and includes built-in pressure regulators and dual-start buttons to ensure operator safety and extend the device's lifespan.
How precise is the bonding process with this machine?
The machine offers high-precision bonding with optical-grade alignment mechanics, ensuring a bubble-free and perfectly laminated surface.
What technical controls does the flex bonding machine offer?
It features a PLC touchscreen interface that allows operators to easily adjust heating, pressure, and vacuum duration parameters for optimal bonding results.