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Glass Bonding Machine — Vacuum Thermocompression Bonder
Jiutu 9TU-M048A Glass Bonding Machine uses vacuum thermocompression technology to bond glass panels and rigid plastic chips. Maximum temperature 200°C, maximum pressure 10KN. Suitable for PMMA, PC, PP, COP, COC, BOPET, and more.
Function: Vacuum hot press glass bonding for display panels, microfluidic devices, and thermoplastic chip bonding. Flexdym polymer molding in as little as 2 minutes.
Applications: Glass-to-glass bonding, glass-to-plastic bonding, PMMA/PC/PP/COP/COC/BOPET chip bonding, microfluidic device manufacturing, display panel assembly.
| P/N | 9TU-M048A |
| Lamination Size | 250×250 mm |
| Working Temperature | 10°C to 60°C |
| Rated Power | 3800W |
| Machine Size | 50×50×93 cm |
| Net Weight | 160 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What types of glass bonding applications is this Glass Bonding Machine suitable for?
A: The Jiutu Glass Bonding Machine is suitable for optical glass bonding (display cover glass to LCD panel), glass-to-plastic bonding, and rigid chip bonding (PMMA, PC, PP, COP, COC, BOPET). It is widely used in mobile phone screen refurbishment, industrial display manufacturing, and microfluidic device assembly where bubble-free, high-strength bonds are required.
Q2: Does the Glass Bonding Machine require any special adhesive or OCA film?
A: The Glass Bonding Machine uses vacuum thermocompression bonding, which can work with OCA (Optically Clear Adhesive) film, SCA (Super Clear Adhesive), or other thermoplastic bonding materials depending on the application. The machine’s precise temperature (up to 200°C) and pressure (0.4–0.8 MPa) control ensures optimal adhesive activation and void-free bonding results.