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Hot Press Bonding Machine — Vacuum Thermocompression Bonder
Jiutu 9TU-M048A Hot Press Bonding Machine uses vacuum thermocompression technology to bond rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN. Suitable for PMMA, PC, PP, COP, COC, BOPET, and more.
Function: Vacuum hot press bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.
Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel bonding.
| P/N | 9TU-M048A |
| Lamination Size | 250×250 mm |
| Working Temperature | 10°C to 60°C |
| Working Humidity | 40%–95% RH |
| Rated Power | 3800W |
| Machine Size | 50×50×93 cm |
| Net Weight | 160 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What types of plastic chips can the Hot Press Bonding Machine bond?
A: The Jiutu Hot Press Bonding Machine is suitable for bonding rigid plastic chips including PMMA, PC, PP, COP, COC, BOPET, CBC, resin (partial), and polyethylene (partial). It can also mold Flexdym polymer in as little as 2 minutes and process various other thermoplastics such as acrylic. The maximum bonding temperature is 200°C with a maximum pressure of 10KN.
Q2: Does the Hot Press Bonding Machine require an external vacuum pump?
A: No. The Jiutu Hot Press Bonding Machine has a built-in vacuum system. The machine uses resistance heating combined with cylinder pressure under vacuum to achieve high-density bonding. The working pressure range is 0.4–0.8 MPa (4–6 kgf/cm²), and the machine operates on standard 220V 50Hz power supply.