Laser BGA Rework Station

Four In One Integrated Laser Head: The Jiutu 2206 combines an infrared laser heater, a thermal imaging camera, a high definition microscope and built in lighting in one working head, removing the need for four separate instruments. Technicians can diagnose a fault and finish the desoldering task without moving the motherboard between stations.

Thermal Imaging Fault Diagnosis: The built in thermal camera scans a powered circuit board and highlights abnormal heat points on the ten inch screen, so short circuits are located in seconds rather than hours of manual probing. This turns a conventional soldering station into a complete troubleshooting tool for mobile phone logic board repair.

Precise Non Contact Laser Heating: Focused laser energy delivers constant temperature heating from 100 to 450 degrees Celsius across an adjustable area of 5 to 30 millimetres with no heat radiation toward neighbouring parts. Unlike a hot air gun that spreads uncontrolled heat, the beam affects only the target chip, protecting surrounding capacitors and raising the success rate of BGA and IC chip removal.

Durable Aluminium Alloy Construction: The housing is machined from full aluminium alloy with multiple cooling fans for continuous heat dissipation during long shifts. At 320 by 280 by 350 millimetres and 8 kilograms, the compact desktop footprint suits crowded benches, while the wide 110 to 220 volt input suits workshops in any region.

Simple Operation And Optional Accessories: A ten inch display and a hands free foot switch let one operator control heating while holding tweezers, and the power cord and foot switch are included as standard. An optional vacuum pen and biaxial motherboard fixture serve shops handling high volume chip level repair, supported by full video tutorials and one to one expert guidance.