Jiutu High Press Temperature Equipment Bonding Hard Plastic Chips For Laboratory Heat Press
SCA, COF, and other hot-melt adhesive vacuum lamination and hot-press lamination, SCA/OCF and other hot-melt adhesive processes for medium and large size G+G and full lamination;-- Jiutu High Press Temperature Bonding Machine
Main Features :
1. High Temperature vacuum laminator fit for LCD Screen up to 32 inches , lamination area size 510*710mm-- Jiutu High Press Temperature Bonding Machine
2. Customized mold will be necessary based on the actual product-- Jiutu High Press Temperature Bonding Machine
3. Work fast needs 25-40 seconds for each time. depend on the product-- Jiutu High Press Temperature Bonding Machine
4. Fully automatic , easy operation-- Jiutu High Press Temperature Bonding Machine
5. It is mainly suitable for the bonding of hard plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 150 degrees; the maximum pressure is 10KN.-- Jiutu High Press Temperature Bonding Machine
Specification :
1,University laboratory test, company laboratory test, medical field,
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P/N
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9TU-M040D
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Model
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150 Degree Vacuum Laminator Hot Press Machine
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Brand
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Jiutu
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Lamination Size
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Under 32 inches
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Tempature Range
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up to 150℃
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Success Rate
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99%
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Working Rated Power
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7KW
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Net Weight
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600kg
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Warrantty
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2 Years
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Working Temperature
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Normal temp till -150 ℃ all works
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Working Pressure
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0.4-0.8Mpa can be adjusted
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Volatge,Power Supply
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380V 50Hz
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