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JiuTu Machine

High-temperature Precision Bonding Machine

High-temperature Precision Bonding Machine

$32,000.00 USD
$35,000.00 USD $32,000.00 USD
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Brand Model
9TU-M040B
Laminating Platform Size
200mm × 200mm
Temperature Range
Room Temperature – 200°C (Adjustable)
Temperature Uniformity
±2°C (tested at 100°C)
Heating Method
Electric, 4-stage segmented heating (customizable)
Displacement Accuracy
±0.02mm
Pressing Speed
0.01–30 mm/s (Adjustable)
Probing Speed
0.01–20 mm/s (Adjustable)
Power Supply
AC 220V 50Hz
Power Consumption
Approx. 3750W
Applicable Materials
SCA/OCA adhesive, LCD, TP/LCM, COP, COC, PMMA, PC, PHA, plastics, glass, metal, aerogel, composite film, fiber board


The 9TU-M040B Servo Vacuum Hot Press Machine is a high-temperature,high-pressure, high-precision press-fitting system with a 200x200mm laminating platform, built for products requiring exact temperature and force control.

Servo electric cylinder drive: precise closed-loop control of press force and position throughout the entire pressing process. Pressing force up to 10KN, displacement accuracy ±0.02mm, pressure accuracy ±5 per mille.

Temperature system: room temperature to 200°C, upper and lower heating plates independently controlled, 4-stage heating (segments customizable),temperature uniformity ±2°C with PID algorithm for high production yield.

Built-in vacuum system (-98kPa to -100kPa) with selectable vacuum or non-vacuum pressing mode — the machine needs power connection only, no external gas source required.

10-inch touchscreen HMI stores up to 2,000 process recipes. Pressing force, position, speed, temperature, and dwell time are all numerically settable. Historical displacement, pressure and temperature data can be exported to Excel for quality traceability.

Applicable to SCA/OCA bonding, LCD, TP/LCM, polymers (COP, COC, PMMA, PC),plastic/glass/metal parts, aerogels, new energy components, aviation parts, chips/PCB, electronic connectors, microfluidics and new material development. Suitable for university research, laboratory R&D and factory mass production.

Power: AC 220V 50Hz, approx. 3750W. CE certified. 1-year warranty.

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Frequently Asked Questions

What types of materials can be bonded using the High Temperature Bonding Hot Press Machine?
This hot press machine is suitable for bonding various high-temperature materials such as liquid crystal, TP/LCM, polymer materials including COP, COC, PMMA, and PC, making it ideal for applications in new material industries.
How does the vacuum feature enhance the bonding process?
The vacuum mode helps remove air and gases from between the materials, ensuring a more uniform and precise bond, which is especially important for high-precision and high-quality bonding of electronic components and advanced materials.
Can the platform size and lamination height be customized to suit specific manufacturing needs?
Yes, the platform size (200mm x 200mm) and lamination stroke height (100mm) are customizable to accommodate different product sizes and bonding requirements.
What are the key advantages of using this high temperature hot press for industrial applications?
This equipment offers precise temperature, pressure, and position control, with features like multi-level hot pressing and vacuum mode, ensuring high precision, sensitivity, and flexibility for manufacturing and research of advanced materials.
What is the power supply requirement for operating the High Temperature Bonding Hot Press Machine?**
The machine operates on an AC220V, 50Hz power supply, suitable for standard electrical connections in most industrial settings.
What products can the High-temperature Precision Bonding Machine press or bond?
The High Temperature Bonding machine is described for hot pressing and bonding products involving SCA/OCA glue, LCD and TP/LCM assemblies, and polymer materials such as COP, COC, PMMA, and PC. Listed applications also include precision pressing of plastic, glass, metal, and special-material parts, as well as chips, circuit boards, and electronic plug-in parts.
How does this machine control the hot-pressing process?
The machine provides multi-level control of temperature, pressure, and position. Its description also specifies upper and lower constant-temperature heating, with a servo electric cylinder as the driving force source and PLC and touchscreen logic control.
What are the platform size and lamination height, and can they be customized?
The platform measures 200 × 200 mm and can be customized. The lamination stroke height is 100 mm and is also listed as customizable.
What power supply does the High-temperature Precision Bonding Machine require?
The listed power supply specification is AC 220 V, 50 Hz. Check that this matches your intended installation before purchasing.
Does this precision bonding machine offer vacuum operation and adjustable speed?
Yes. The machine offers vacuum mode or no-vacuum mode. Its laminating speed can be set from 0.1 to 20 mm/sec, and its buffer speed is listed as settable from 0.1 to 20 m/s.