• Press soldering machine for microfluidic chip bonding with vacuum thermocompression and temperature pressure control.
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine
  • Press Soldering Machine - Phone Repair Tools Machine Parts
  • Press Soldering Machine - Phone Repair Tools Machine Parts
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JiuTu Christin

Press Soldering Machine

Press Soldering Machine

$25,000.00 USD
$25,000.00 USD $25,000.00 USD
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Press Soldering Machine — Vacuum Thermocompression Bonder

Jiutu 9TU-M048A Press Soldering Machine uses vacuum thermocompression technology for precision soldering and bonding of rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN.

Function: Vacuum hot press soldering for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.

Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel soldering and bonding.

P/N 9TU-M048A
Lamination Size 250×250 mm
Working Temperature 10°C to 60°C
Working Humidity 40%–95% RH
Rated Power 3800W
Machine Size 50×50×93 cm
Net Weight 160 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: What is the difference between the Press Soldering Machine and a standard soldering iron?

A: The Jiutu Press Soldering Machine uses vacuum thermocompression technology, applying simultaneous heat, pressure, and vacuum to bond materials. Unlike a standard soldering iron that applies heat to a single point, this machine presses an entire bonding area (up to 250×250mm) uniformly under vacuum, resulting in a stronger, void-free bond with consistent quality across the entire surface.

Q2: Is the Press Soldering Machine suitable for FPC (Flexible Printed Circuit) bonding?

A: Yes. The Jiutu Press Soldering Machine is suitable for FPC bonding and other precision electronic component bonding applications. The precise temperature control (up to 200°C) and pressure control (0.4–0.8 MPa) make it ideal for bonding flexible circuits, display connectors, and other sensitive electronic components that require controlled thermocompression bonding.

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Frequently Asked Questions

What materials can I bond using the Press Soldering Machine?
The Press Soldering Machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, and resin parts, with temperature up to 200°C and pressure of up to 10KN.
How does the Press Soldering Machine enhance microfluidic device manufacturing?
This machine facilitates rapid fabrication of microfluidic devices through temperature and pressure control, allowing bonding within minutes, making it a highly efficient alternative for soft lithography micromachining.
What are the technical specifications of the Press Soldering Machine?
The machine has a lamination size of 250x250mm, a working temperature range from 10°C to 60°C, power consumption of 3800W, and operates at 220V 50Hz with a maximum pressure of 10KN.
Is the Press Soldering Machine suitable for professional laboratory or industrial use?
Yes, it is designed for professional settings, offering precise temperature and pressure control for creating reliable bonds in microfluidic and thermoplastic device manufacturing.
What maintenance or care is required for the Press Soldering Machine?
Routine maintenance includes keeping the work surface clean, inspecting electrical components regularly, and ensuring proper operation of the temperature and pressure controls to maintain optimal performance.