• Vacuum bonding machine for microfluidic chip thermocompression bonding and hot pressing of rigid plastic materials.
  • Vacuum Bonding Machine
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  • Vacuum Bonding Machine - Phone Repair Tools Machine Parts
  • Vacuum Bonding Machine - Phone Repair Tools Machine Parts
  • Vacuum Bonding Machine - Phone Repair Tools Machine Parts
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JiuTu Machine

Vacuum Bonding Machine

Vacuum Bonding Machine

$28,000.00 USD
$28,000.00 USD $28,000.00 USD
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Vacuum Bonding Machine — Thermocompression Bonder

Jiutu 9TU-M048A Vacuum Bonding Machine uses vacuum thermocompression technology to bond rigid plastic chips and thermoplastic materials under vacuum. Maximum temperature 200°C, maximum pressure 10KN. Eliminates air bubbles for superior bond quality.

Function: Vacuum hot press bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.

Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel bonding.

P/N 9TU-M048A
Lamination Size 250×250 mm
Working Temperature 10°C to 60°C
Rated Power 3800W
Machine Size 50×50×93 cm
Net Weight 160 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: Why is vacuum bonding superior to standard pressure bonding?

A: The Jiutu Vacuum Bonding Machine removes all air from the bonding interface before applying heat and pressure. This eliminates air bubbles, voids, and oxidation that would otherwise weaken the bond. The result is a denser, stronger bond with improved mechanical strength, hardness, and thermal stability. The simultaneous action of high temperature, pressure, and vacuum significantly enhances the final product quality.

Q2: What is the maximum bonding area of the Vacuum Bonding Machine?

A: The Jiutu Vacuum Bonding Machine has a lamination area of 250×250mm. It operates at up to 200°C and 0.4–0.8 MPa pressure on 220V 50Hz power. For bonding requirements larger than 250×250mm, please contact Jiutu for customized vacuum bonding machine solutions.

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Frequently Asked Questions

What materials can the vacuum bonding machine effectively bond?
The vacuum bonding machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin parts, and polyethylene, making it versatile for various microfluidic device applications.
How does the vacuum bonding machine improve the bonding process?
The vacuum bonding machine uses vacuum, high temperature, and pressure to bond materials quickly and reliably, enhancing the microstructure, increasing density, and reducing voids for a superior seal in microfluidic device manufacturing.
What are the key specifications of the vacuum bonding machine?
The vacuum bonding machine can operate at a maximum temperature of 200°C and a maximum pressure of 10KN, allowing it to effectively bond various thermoplastics and other materials with precision.
Is the vacuum bonding machine suitable for mass production?
Yes, the vacuum bonding machine is designed for rapid and efficient production, capable of bonding multiple microfluidic chips in minutes, making it ideal for both small-scale and large-scale manufacturing.
How should I maintain and care for the vacuum bonding machine?
Regular cleaning of the heating elements and vacuum components, along with proper calibration of temperature and pressure controls, will ensure optimal performance and longevity of the vacuum bonding machine.