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Vacuum Bonding Machine — Thermocompression Bonder
Jiutu 9TU-M048A Vacuum Bonding Machine uses vacuum thermocompression technology to bond rigid plastic chips and thermoplastic materials under vacuum. Maximum temperature 200°C, maximum pressure 10KN. Eliminates air bubbles for superior bond quality.
Function: Vacuum hot press bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.
Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel bonding.
| P/N | 9TU-M048A |
| Lamination Size | 250×250 mm |
| Working Temperature | 10°C to 60°C |
| Rated Power | 3800W |
| Machine Size | 50×50×93 cm |
| Net Weight | 160 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: Why is vacuum bonding superior to standard pressure bonding?
A: The Jiutu Vacuum Bonding Machine removes all air from the bonding interface before applying heat and pressure. This eliminates air bubbles, voids, and oxidation that would otherwise weaken the bond. The result is a denser, stronger bond with improved mechanical strength, hardness, and thermal stability. The simultaneous action of high temperature, pressure, and vacuum significantly enhances the final product quality.
Q2: What is the maximum bonding area of the Vacuum Bonding Machine?
A: The Jiutu Vacuum Bonding Machine has a lamination area of 250×250mm. It operates at up to 200°C and 0.4–0.8 MPa pressure on 220V 50Hz power. For bonding requirements larger than 250×250mm, please contact Jiutu for customized vacuum bonding machine solutions.