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ACF Bonding Machine — FPC/FFC Pulse Hot Press Bonder
Jiutu 9TU-M039A ACF Bonding Machine uses ACF (Anisotropic Conductive Film) glue process with pulse heating to bond chips, FPC, and FFC cables to display panels. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone repair, medical, and R&D fields.
Main Features:
● Pulse heating — precise temperature control for ACF bonding
● 45# steel main structure — high precision and stability
● Japanese SMC cylinder + precision pressure regulating valve
● Imported thermal insulation module and tungsten steel cutter head
● HD auxiliary alignment camera system
● Platform pre-heating function
| P/N | 9TU-M039A |
| Heating Method | Pulse heating |
| Working Temperature | 0°C to 500°C |
| Rated Power | 2500W |
| Machine Size | 64×55×57 cm |
| Net Weight | 85 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What types of cables and connectors can the ACF Bonding Machine bond?
A: The Jiutu ACF Bonding Machine is designed to bond FPC (Flexible Printed Circuit) cables, FFC (Flat Flexible Cable) cables, and chips to display panels and PCBs using ACF (Anisotropic Conductive Film). It is widely used in mobile phone display cable binding, tablet screen connector bonding, medical device assembly, and laboratory R&D testing applications.
Q2: How does the ACF Bonding Machine achieve precise alignment during bonding?
A: The Jiutu ACF Bonding Machine features an HD auxiliary alignment camera system that can be positioned up or down according to requirements. The lens magnification can be configured based on customer samples. Combined with the platform pre-heating function and Japanese SMC cylinder for precise pressure control, the machine ensures accurate, repeatable alignment for every bonding operation.