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High Temperature Vacuum Machine — Thermocompression Bonding
Jiutu 9TU-M048A High Temperature Vacuum Machine is a vacuum thermocompression bonding machine for rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN. Bonds PMMA, PC, PP, COP, COC, BOPET, and more under vacuum for superior bond quality.
Function: High temperature vacuum bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.
Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; industrial display panel bonding.
| P/N | 9TU-M048A |
| Lamination Size | 250×250 mm |
| Working Temperature | 10°C to 60°C |
| Working Humidity | 40%–95% RH |
| Rated Power | 3800W |
| Machine Size | 50×50×93 cm |
| Net Weight | 160 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What is the maximum operating temperature of the High Temperature Vacuum Machine?
A: The Jiutu High Temperature Vacuum Machine can reach a maximum bonding temperature of 200°C with a maximum pressure of 10KN. The working environment temperature range is 10°C to 60°C. This high-temperature capability makes it suitable for bonding a wide range of thermoplastic materials including PMMA, PC, PP, COP, COC, BOPET, and CBC.
Q2: How does the vacuum environment improve the bonding quality in this machine?
A: The vacuum environment in the High Temperature Vacuum Machine removes air and moisture from between the bonding surfaces before and during the pressing process. This prevents bubble formation, oxidation, and delamination. The result is a dense, void-free bond with significantly improved mechanical strength, hardness, and thermal stability compared to bonding in open air.