• High Temperature Vacuum Machine for microfluidic chip bonding and thermoplastic molding with temperature and pressure control
  • High Temperature Vacuum Machine - Phone Repair Tools Machine Parts
  • High Temperature Vacuum Machine - Phone Repair Tools Machine Parts
  • High Temperature Vacuum Machine
  • High Temperature Vacuum Machine - Phone Repair Tools Machine Parts
  • High Temperature Vacuum Machine - Phone Repair Tools Machine Parts
1 6

JiuTu Machine

High Temperature Vacuum Machine

High Temperature Vacuum Machine

$25,000.00 USD
$25,000.00 USD $25,000.00 USD
Promotion Épuisé
Frais d'expédition calculés à l'étape de paiement.

High Temperature Vacuum Machine — Thermocompression Bonding

Jiutu 9TU-M048A High Temperature Vacuum Machine is a vacuum thermocompression bonding machine for rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN. Bonds PMMA, PC, PP, COP, COC, BOPET, and more under vacuum for superior bond quality.

Function: High temperature vacuum bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.

Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; industrial display panel bonding.

P/N 9TU-M048A
Lamination Size 250×250 mm
Working Temperature 10°C to 60°C
Working Humidity 40%–95% RH
Rated Power 3800W
Machine Size 50×50×93 cm
Net Weight 160 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: What is the maximum operating temperature of the High Temperature Vacuum Machine?

A: The Jiutu High Temperature Vacuum Machine can reach a maximum bonding temperature of 200°C with a maximum pressure of 10KN. The working environment temperature range is 10°C to 60°C. This high-temperature capability makes it suitable for bonding a wide range of thermoplastic materials including PMMA, PC, PP, COP, COC, BOPET, and CBC.

Q2: How does the vacuum environment improve the bonding quality in this machine?

A: The vacuum environment in the High Temperature Vacuum Machine removes air and moisture from between the bonding surfaces before and during the pressing process. This prevents bubble formation, oxidation, and delamination. The result is a dense, void-free bond with significantly improved mechanical strength, hardness, and thermal stability compared to bonding in open air.

Afficher tous les détails

Frequently Asked Questions

What materials can the High Temperature Vacuum Machine bond effectively?
The High Temperature Vacuum Machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, and other thermoplastics, making it ideal for microfluidic device fabrication.
What is the maximum temperature and pressure the vacuum machine can handle?
The machine operates at a maximum temperature of 200°C and can apply a maximum pressure of 10KN, enabling high-quality bonding and molding of various thermoplastics.
How does the vacuum hot pressing process improve material properties?
Using high temperature, pressure, and vacuum, the process reduces voids and grain boundaries, increases density and hardness, and creates a dense, microstructurally controlled polycrystalline body.
What are the key specifications of the High Temperature Vacuum Machine?
It features a lamination size of 250x250mm, adjustable working temperature from 10°C to 60°C, power consumption of 3800W, and operates at 220V 50Hz with a size of 50x50x93cm and a weight of 160kg.
Is this vacuum machine suitable for producing microfluidic devices rapidly?
Yes, the vacuum hot press is designed for quick manufacturing of microfluidic devices, with optimized processes allowing polymer molding within just 2 minutes, making it a highly efficient solution for rapid production.