• Industrial hot press bonding machine for microfluidic chip bonding and thermoplastic molding
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  • Hot Press Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Press Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Press Bonding Machine
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JiuTu Machine

Hot Press Bonding Machine

Hot Press Bonding Machine

$25,000.00 USD
$25,000.00 USD $25,000.00 USD
Promotion Épuisé
Frais d'expédition calculés à l'étape de paiement.

Hot Press Bonding Machine — Vacuum Thermocompression Bonder

Jiutu 9TU-M048A Hot Press Bonding Machine uses vacuum thermocompression technology to bond rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN. Suitable for PMMA, PC, PP, COP, COC, BOPET, and more.

Function: Vacuum hot press bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.

Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel bonding.

P/N 9TU-M048A
Lamination Size 250×250 mm
Working Temperature 10°C to 60°C
Working Humidity 40%–95% RH
Rated Power 3800W
Machine Size 50×50×93 cm
Net Weight 160 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: What types of plastic chips can the Hot Press Bonding Machine bond?

A: The Jiutu Hot Press Bonding Machine is suitable for bonding rigid plastic chips including PMMA, PC, PP, COP, COC, BOPET, CBC, resin (partial), and polyethylene (partial). It can also mold Flexdym polymer in as little as 2 minutes and process various other thermoplastics such as acrylic. The maximum bonding temperature is 200°C with a maximum pressure of 10KN.

Q2: Does the Hot Press Bonding Machine require an external vacuum pump?

A: No. The Jiutu Hot Press Bonding Machine has a built-in vacuum system. The machine uses resistance heating combined with cylinder pressure under vacuum to achieve high-density bonding. The working pressure range is 0.4–0.8 MPa (4–6 kgf/cm²), and the machine operates on standard 220V 50Hz power supply.

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Frequently Asked Questions

What materials can I bond using the Hot Press Bonding Machine?
The Hot Press Bonding Machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin, and polyethylene, making it versatile for various microfluidic and thermoplastic applications.
How long does the bonding process typically take with this machine?
The Hot Press Bonding Machine is optimized to make materials like Flexdym polymer molding in just 2 minutes, providing a rapid and efficient bonding process.
What are the operating temperature and pressure ranges for the Hot Press Bonding Machine?
The machine operates at a maximum temperature of 200°C and a maximum pressure of 10KN, allowing precise control for effective bonding of different materials.
Can I use the Hot Press Bonding Machine for vacuum-assisted bonding?
Yes, the vacuum hot press feature allows for bonding under vacuum or with other gases, which enhances the density and quality of the bonds for high-precision applications.
What are the key specifications of the Hot Press Bonding Machine?
This model has a lamination size of 250*250mm, operating temperature of 10°C to 60°C, power of 3800W, and dimensions of 50*50*93 cm, making it suitable for various industrial bonding needs.