Bonding machine
Function :
Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic--Bonding machine
Specification :
Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.--Bonding machine
Application :
Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.--Bonding machine
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Model
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High Temperature Hot Pressing Machine
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P/N
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9TU-M048A
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Lamination Size
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250*250mm
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Working Tempature
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10℃ to 60℃
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Working Humidity
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40%--95%RH
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Working Rated Power
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3800W
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Machine Size
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50*50*93CM
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Net Weight
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160kg
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Working Pressure
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4--6kgf/cm2
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Working Pressure
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0.4-0.8Mpa
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Volatge,Power Supply
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220V 50Hz
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Bonding machine
