• Jiutu 9TU-M039A ACF Bonding Machine with pulse heating and HD alignment camera for bonding FPC and FFC cables to display panels
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
  • ACF Bonding Machine
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
  • ACF Bonding Machine - Phone Repair Tools Machine Parts
1 6

JiuTu Machine

ACF Bonding Machine

ACF Bonding Machine

$4,850.00 USD
$4,850.00 USD $4,850.00 USD
Sale Sold out
Shipping calculated at checkout.

ACF Bonding Machine — FPC/FFC Pulse Hot Press Bonder

Jiutu 9TU-M039A ACF Bonding Machine uses ACF (Anisotropic Conductive Film) glue process with pulse heating to bond chips, FPC, and FFC cables to display panels. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone repair, medical, and R&D fields.

Main Features:

● Pulse heating — precise temperature control for ACF bonding

● 45# steel main structure — high precision and stability

● Japanese SMC cylinder + precision pressure regulating valve

● Imported thermal insulation module and tungsten steel cutter head

● HD auxiliary alignment camera system

● Platform pre-heating function

P/N 9TU-M039A
Heating Method Pulse heating
Working Temperature 0°C to 500°C
Rated Power 2500W
Machine Size 64×55×57 cm
Net Weight 85 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: What types of cables and connectors can the ACF Bonding Machine bond?

A: The Jiutu ACF Bonding Machine is designed to bond FPC (Flexible Printed Circuit) cables, FFC (Flat Flexible Cable) cables, and chips to display panels and PCBs using ACF (Anisotropic Conductive Film). It is widely used in mobile phone display cable binding, tablet screen connector bonding, medical device assembly, and laboratory R&D testing applications.

Q2: How does the ACF Bonding Machine achieve precise alignment during bonding?

A: The Jiutu ACF Bonding Machine features an HD auxiliary alignment camera system that can be positioned up or down according to requirements. The lens magnification can be configured based on customer samples. Combined with the platform pre-heating function and Japanese SMC cylinder for precise pressure control, the machine ensures accurate, repeatable alignment for every bonding operation.

View full details

Frequently Asked Questions

What are the main applications of the ACF Bonding Machine?
The ACF Bonding Machine is widely used in mobile phone repair, medical device assembly, and R&D fields for bonding chips, FPC, and FFC cables to display panels using ACF (Anisotropic Conductive Film).
Can the ACF Bonding Machine accommodate different cable sizes and bonding areas?
Yes, the cutter head of the ACF Bonding Machine is customizable and can be adjusted up to 90×5mm to meet various bonding requirements.
What features ensure the precise bonding and alignment process in the ACF Bonding Machine?
The machine features an HD auxiliary alignment camera system, pulse heating for precise temperature control, and a platform pre-heating function, all contributing to accurate and consistent bonding.
What are the technical specifications of the ACF Bonding Machine?
The machine operates at a temperature range of 0–500°C, with a rated power of 2500W, working pressure of 0.4–0.8 MPa, and dimensions of 64×55×57 cm, weighing 85 kg.
Is the ACF Bonding Machine suitable for use in different industries?
Yes, its features and capabilities make it suitable for use in mobile phone manufacturing, medical device production, and research and development laboratories.