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FPC Soldering Machine — ACF Pulse Hot Press Bonder
Jiutu 9TU-M039A FPC Soldering Machine uses ACF glue process with pulse heating to solder and bond FPC (Flexible Printed Circuit) cables, FFC cables, and chips to display panels and PCBs. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera.
Main Features:
● Pulse heating — precise temperature control for FPC soldering
● 45# steel main structure — high precision and stability
● Japanese SMC cylinder + precision pressure regulating valve
● Imported thermal insulation module and tungsten steel cutter head
● HD auxiliary alignment camera system
● Platform pre-heating function
| P/N | 9TU-M039A |
| Heating Method | Pulse heating |
| Working Temperature | 0°C to 500°C |
| Rated Power | 2500W |
| Machine Size | 64×55×57 cm |
| Net Weight | 85 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What types of FPC connections can the FPC Soldering Machine handle?
A: The Jiutu FPC Soldering Machine handles FPC (Flexible Printed Circuit) to display panel bonding, FPC to PCB bonding, FFC (Flat Flexible Cable) bonding, and chip-on-flex bonding using ACF (Anisotropic Conductive Film). It is widely used for mobile phone display cable connections, camera module FPC bonding, battery connector FPC bonding, and other flexible circuit applications in consumer electronics manufacturing and repair.
Q2: How does the FPC Soldering Machine prevent damage to the flexible circuit during bonding?
A: The Jiutu FPC Soldering Machine uses pulse heating, which only applies heat during the actual bonding press and immediately cools afterward, minimizing heat exposure to the delicate FPC material. The imported thermal insulation module prevents heat from spreading beyond the cutter head contact area. The Japanese SMC cylinder with precision pressure regulating valve ensures the pressing force is precisely controlled to avoid mechanical damage to the flexible circuit.