What types of materials can be bonded using the High Temperature Bonding Hot Press Machine?
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This hot press machine is suitable for bonding various high-temperature materials such as liquid crystal, TP/LCM, polymer materials including COP, COC, PMMA, and PC, making it ideal for applications in new material industries.
How does the vacuum feature enhance the bonding process?
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The vacuum mode helps remove air and gases from between the materials, ensuring a more uniform and precise bond, which is especially important for high-precision and high-quality bonding of electronic components and advanced materials.
Can the platform size and lamination height be customized to suit specific manufacturing needs?
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Yes, the platform size (200mm x 200mm) and lamination stroke height (100mm) are customizable to accommodate different product sizes and bonding requirements.
What are the key advantages of using this high temperature hot press for industrial applications?
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This equipment offers precise temperature, pressure, and position control, with features like multi-level hot pressing and vacuum mode, ensuring high precision, sensitivity, and flexibility for manufacturing and research of advanced materials.
What is the power supply requirement for operating the High Temperature Bonding Hot Press Machine?**
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The machine operates on an AC220V, 50Hz power supply, suitable for standard electrical connections in most industrial settings.
What products can the High-temperature Precision Bonding Machine press or bond?
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The High Temperature Bonding machine is described for hot pressing and bonding products involving SCA/OCA glue, LCD and TP/LCM assemblies, and polymer materials such as COP, COC, PMMA, and PC. Listed applications also include precision pressing of plastic, glass, metal, and special-material parts, as well as chips, circuit boards, and electronic plug-in parts.
How does this machine control the hot-pressing process?
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The machine provides multi-level control of temperature, pressure, and position. Its description also specifies upper and lower constant-temperature heating, with a servo electric cylinder as the driving force source and PLC and touchscreen logic control.
What are the platform size and lamination height, and can they be customized?
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The platform measures 200 × 200 mm and can be customized. The lamination stroke height is 100 mm and is also listed as customizable.
What power supply does the High-temperature Precision Bonding Machine require?
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The listed power supply specification is AC 220 V, 50 Hz. Check that this matches your intended installation before purchasing.
Does this precision bonding machine offer vacuum operation and adjustable speed?
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Yes. The machine offers vacuum mode or no-vacuum mode. Its laminating speed can be set from 0.1 to 20 mm/sec, and its buffer speed is listed as settable from 0.1 to 20 m/s.
What materials and applications is the 9TU-M040B High Temperature Bonding press designed for?
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The machine is listed for SCA/OCA adhesive bonding and work with LCD, TP/LCM, COP, COC, PMMA, PC, plastics, glass, metal, aerogel, composite film, and fiber board. The description also names applications including chips and PCBs, electronic connectors, microfluidics, new energy components, aviation parts, and new-material development.
What are the platform size and temperature capabilities of this vacuum hot press?
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The laminating platform measures 200 × 200 mm, and the adjustable temperature range is room temperature to 200°C. Its upper and lower heating plates are independently controlled, with four-stage electric heating and temperature uniformity specified as ±2°C when tested at 100°C.
How precisely can the servo-driven hot press control force and position?
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The servo electric cylinder provides closed-loop control of press force and position. The product description specifies pressing force up to 10 kN, displacement accuracy of ±0.02 mm, and pressure accuracy of ±5 per mille.
Does the machine require an external air or gas supply for vacuum pressing?
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No external gas source is required: the product has a built-in vacuum system rated at -98 kPa to -100 kPa and needs a power connection. You can select vacuum or non-vacuum pressing mode.
What process settings, power requirements, and warranty are listed?
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The 10-inch touchscreen can store up to 2,000 process recipes, with pressing force, position, speed, temperature, and dwell time numerically settable; historical displacement, pressure, and temperature data can be exported to Excel. The listed power supply is AC 220 V, 50 Hz, with approximately 3,750 W consumption; the description also states CE certification and a one-year warranty.
What is the laminating platform size of this laboratory vacuum hot press?
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The 9TU-M040B High Temperature Bonding machine has a 200 × 200 mm laminating platform. Its listed compatible materials include SCA/OCA adhesive, LCD, TP/LCM, COP, COC, PMMA, PC, plastics, glass, metal, aerogel, composite film, and fiber board.
What temperature range and uniformity does the hot press provide?
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The adjustable temperature range is room temperature to 200°C. The product specifies temperature uniformity of ±2°C, tested at 100°C, and independently controlled upper and lower heating plates.
Does this vacuum hot press need an external gas source?
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No external gas source is required; the product description says the machine needs a power connection only. Its built-in vacuum system operates from -98 kPa to -100 kPa, with selectable vacuum or non-vacuum pressing modes.
Can I save and export process settings and data?
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Yes. The 10-inch touchscreen HMI stores up to 2,000 process recipes, with pressing force, position, speed, temperature, and dwell time numerically settable. Historical displacement, pressure, and temperature data can be exported to Excel.
What power supply, pressing force, and warranty are specified?
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The machine uses AC 220 V, 50 Hz power and has approximate power consumption of 3750 W. Its pressing force is up to 10 kN, and the product description lists a 1-year warranty.
