• Hot Pressing Bonding Machine for microfluidic chip bonding and thermoplastic molding at high temperature and pressure
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Pressing Bonding Machine
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
  • Hot Pressing Bonding Machine - Phone Repair Tools Machine Parts
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JiuTu Machine

Hot Pressing Bonding Machine

Hot Pressing Bonding Machine

$28,000.00 USD
$28,000.00 USD $28,000.00 USD
Распродажа Продано
Стоимость доставки рассчитывается при оформлении заказа.

Hot Pressing Bonding Machine — Vacuum Thermocompression Bonder

Jiutu 9TU-M048A Hot Pressing Bonding Machine uses vacuum thermocompression technology to bond rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN. Suitable for PMMA, PC, PP, COP, COC, BOPET, and more.

Function: Vacuum hot press bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.

Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel bonding.

P/N 9TU-M048A
Lamination Size 250×250 mm
Working Temperature 10°C to 60°C
Rated Power 3800W
Machine Size 50×50×93 cm
Net Weight 160 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: Can the Hot Pressing Bonding Machine bond glass to glass or glass to plastic?

A: Yes. The Jiutu Hot Pressing Bonding Machine can bond glass to glass and glass to plastic using vacuum thermocompression. It is suitable for optical bonding of display cover glass, bonding of rigid plastic chips (PMMA, PC, PP, COP, COC, BOPET), and microfluidic device assembly. The vacuum environment ensures a bubble-free, high-strength bond.

Q2: How long does a typical bonding cycle take with the Hot Pressing Bonding Machine?

A: Bonding cycle time depends on the material. For Flexdym polymer, the machine can complete molding in as little as 2 minutes. For rigid plastic chips such as PMMA and PC, the cycle typically takes a few minutes depending on the required temperature and pressure settings. The precise PLC control system allows operators to program and repeat bonding parameters consistently.

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Frequently Asked Questions

What materials can I bond using the Hot Pressing Bonding Machine?
The Hot Pressing Bonding Machine is mainly suitable for bonding rigid plastic chips such as PMMA, PC, PP, COP, COC, and other thermoplastics, ensuring versatile application for various microfluidic device manufacturing needs.
How quickly can I achieve bonding with this machine?
The hot pressing process for materials like Flexdym polymer can be completed in just 2 minutes, making it an efficient tool for rapid microfluidic device fabrication.
What are the temperature and pressure limits of the Hot Pressing Bonding Machine?
The machine operates at a maximum temperature of 200 degrees Celsius and can handle pressures up to 10KN, providing ample range for effective bonding of various thermoplastics.
Is the Hot Pressing Bonding Machine suitable for high-quality microfluidic device production?
Yes, by using advanced temperature and pressure control, along with vacuum or gas assistance, this machine ensures high-density, precise bonding essential for high-quality microfluidic devices.
How does vacuum hot pressing improve material bonding in this machine?
Vacuum hot pressing removes air voids and reduces porosity during bonding, resulting in stronger, more uniform bonds, enhanced density, and improved microstructure of the final product.