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JiuTu Machine

Hot Press Machine

Hot Press Machine

Regular price $4,850.00 USD
Regular price $4,850.00 USD Sale price $4,850.00 USD
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Hot Press Machine — ACF/FPC Pulse Bonding Machine

Jiutu 9TU-M039A Hot Press Machine uses pulse heating and ACF glue process to bond chips, FPC, and FFC cables. Temperature range 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera system. Used in mobile phone cable binding, medical, and R&D applications.

Main Features:

● Pulse heating with constant temperature control

● 45# steel main structure — high precision and stability

● Japanese SMC cylinder + precision pressure regulating valve

● Imported thermal insulation module and tungsten steel cutter head

● HD auxiliary alignment camera system

● Platform pre-heating function

P/N 9TU-M039A
Heating Method Pulse heating
Working Temperature 0°C to 500°C
Rated Power 2500W
Machine Size 64×55×57 cm
Net Weight 85 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: What is the ACF bonding process and how does this Hot Press Machine use it?

A: ACF (Anisotropic Conductive Film) bonding uses conductive particles embedded in adhesive film to create electrical connections between chips, FPC (Flexible Printed Circuits), or FFC cables and display panels. The Jiutu Hot Press Machine applies precise temperature (0–500°C) and pressure (0–0.6 MPa) to hot-press and burst the ACF particles, achieving vertical electrical conduction while maintaining horizontal non-conduction for reliable, precise connections.

Q2: Can the cutter head of the Hot Press Machine be customized for different FPC sizes?

A: Yes. The cutter head of the Jiutu Hot Press Machine can be customized within 90mm length × 5mm width to match different FPC and FFC cable sizes. The camera alignment system can also be positioned up or down and configured with different lens magnifications based on customer samples, ensuring precise alignment for various component sizes.

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Frequently Asked Questions

What types of bonding processes does the Hot Press Machine support?
The Hot Press Machine utilizes the ACF pulse bonding process, which uses conductive particles embedded in adhesive film to create electrical connections between chips, FPC, and FFC cables efficiently and reliably.
Is the cutter head on the Hot Press Machine customizable for different component sizes?
Yes, the cutter head can be customized up to 90×5mm to accommodate various FPC and FFC sizes, ensuring precise cuts for different applications.
What safety and precision features does the Hot Press Machine offer?
The machine features a high-precision HD alignment camera system for accurate positioning, as well as imported thermal insulation and a tungsten steel cutter head for durability and stability during operation.
What is the temperature range and pressure capacity of the Hot Press Machine?
It operates within a temperature range of 0–500°C and can apply pressure from 0.4 to 0.8 MPa, making it suitable for various bonding and rework processes.
In what industries can I use the Hot Press Machine?
The Hot Press Machine is ideal for use in mobile phone cable binding, medical device manufacturing, and R&D applications, where precise bonding of chips, FPC, and FFC cables is required.