Hot Press Pulse Machine

Hot Press Pulse Machine — ACF/FPC Pulse Bonding Machine

Jiutu 9TU-M039A Hot Press Pulse Machine uses pulse heating and ACF glue process to bond chips, FPC, and FFC cables. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone cable binding, medical, and R&D applications.

Main Features:

● Pulse heating — rapid, precise temperature control

● 45# steel main structure — high precision and stability

● Japanese SMC cylinder + precision pressure regulating valve

● Imported thermal insulation module and tungsten steel cutter head

● HD auxiliary alignment camera system

● Platform pre-heating function

Frequently Asked Questions

Q1: What is pulse heating and why is it used in the Hot Press Pulse Machine?

A: Pulse heating rapidly heats the cutter head to the target temperature in milliseconds and then cools it down immediately after the bonding cycle. Unlike constant heating, pulse heating minimizes thermal stress on sensitive components (FPC cables, display panels, chips) by only applying heat during the actual bonding press. The Jiutu Hot Press Pulse Machine uses this method to achieve precise, repeatable bonding results with minimal risk of heat damage to surrounding components.

Q2: What is the temperature range of the Hot Press Pulse Machine and is it adjustable?

A: Yes. The Jiutu Hot Press Pulse Machine has a working temperature range of 0–500°C, which is fully adjustable to match the specific requirements of different ACF adhesive types and bonding materials. The pressure is also adjustable from 0 to 0.6 MPa. Both temperature and pressure parameters can be precisely set and saved for repeatable bonding operations.