Soldering Press Machine

Soldering Press Machine — ACF/FPC Pulse Hot Press Bonder

Jiutu 9TU-M039A Soldering Press Machine uses pulse heating and ACF glue process to solder and bond chips, FPC, and FFC cables. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone cable binding, medical, and R&D applications.

Main Features:

● Pulse heating — rapid, precise temperature control for soldering

● 45# steel main structure — high precision and stability

● Japanese SMC cylinder + precision pressure regulating valve

● Imported thermal insulation module and tungsten steel cutter head

● HD auxiliary alignment camera system

● Platform pre-heating function

Frequently Asked Questions

Q1: How does the Soldering Press Machine differ from a reflow soldering oven?

A: The Jiutu Soldering Press Machine applies localized heat and pressure directly to the bonding area using a precision cutter head, while a reflow oven heats the entire PCB in a conveyor tunnel. The Soldering Press Machine is ideal for precision FPC and FFC cable bonding where only a specific area should be heated, preventing thermal damage to surrounding components. It also uses ACF adhesive rather than solder paste, making it suitable for display connector bonding applications.

Q2: What is the role of the platform pre-heating function in the Soldering Press Machine?

A: The platform pre-heating function in the Jiutu Soldering Press Machine warms the substrate (display panel or PCB) to a controlled temperature before the main bonding press. This reduces thermal shock to the components, improves ACF adhesive flow and activation, and ensures more uniform bonding across the entire contact area. Pre-heating is especially important for large or thick substrates that require more time to reach the optimal bonding temperature.