Main Features :
1,Reliable and interlocking safety protection, discharge automatically after removing bubble--Air Bubble Remove
2,Only connect to the Air compressor , the machine will work smoothly
3 This equipment is high pressure heating ITO+CG, FILM+CG, CTP+LCD module defoaming machine.--Air Bubble Remove
4.This equipment is suitable for the process of defoaming it after hard-hard bonding (CG bonding) or assembly (CTP+LCD) process.
5. This equipment is for simultaneous temperature rise and boost.
1.1 Equipment introduction and purpose
1.1.1 : This equipment is a segmented high-pressure defoaming machine (bubble remover machine).--Air Bubble Remove
It’s widely used for electronics and optoelectronics industry, Removing air bubbles and vacuum bubbles
after vacuum lamination with optical glue SCA and OCA glue. Effectively improve product yield.

1.1.2 : Segmented high-pressure , both temperature and pressure can be adjusted by different segmented based on the actual product, max temperature is 80 degree , max pressure is 0.9Mpa--Air Bubble Remove

1.2 Equipment technical parameters
1.2.1 machine size : 158*103*170cm
1.2.2 Inner chamber size : Diameter 600mm Depth 900mm
1.2.3 Gross weight about 480KG
1.2.3 Safety pressure :0.8mpa
1.2.4 Volatge AC 220V

1.3 Equipment Installation
1.3.1 Power supply, to ensure the power supply demand AC220V 2000W.
1.3.2 Air supply to ensure the air pressure supply 0.8mpa.--Air Bubble Remove
1.3.3 Machine installation, 12 casters adjust the horizontal state, and the casters are locked and fixed.--Air Bubble Remove