Press Soldering Machine
Function :
Specification :
Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.--Press Soldering Machine
Application :
Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.--Press Soldering Machine
|
Model
|
Press Soldering Machine
|
|
P/N
|
9TU-M048A
|
|
Lamination Size
|
250*250mm
|
|
Working Tempature
|
10℃ to 60℃
|
|
Working Humidity
|
40%--95%RH
|
|
Working Rated Power
|
3800W
|
|
Machine Size
|
50*50*93CM
|
|
Net Weight
|
160kg
|
|
Working Pressure
|
4--6kgf/cm2
|
|
Working Pressure
|
0.4-0.8Mpa
|
|
Volatge,Power Supply
|
220V 50Hz
|
Press Soldering Machine
