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Hot Pressing Bonding Machine — Vacuum Thermocompression Bonder
Jiutu 9TU-M048A Hot Pressing Bonding Machine uses vacuum thermocompression technology to bond rigid plastic chips and thermoplastic materials. Maximum temperature 200°C, maximum pressure 10KN. Suitable for PMMA, PC, PP, COP, COC, BOPET, and more.
Function: Vacuum hot press bonding for microfluidic devices, thermoplastic molding, and rigid plastic chip bonding. Flexdym polymer molding in as little as 2 minutes.
Applications: PMMA, PC, PP, COP, COC, BOPET, CBC, resin, polyethylene chip bonding; microfluidic device manufacturing; display panel bonding.
| P/N | 9TU-M048A |
| Lamination Size | 250×250 mm |
| Working Temperature | 10°C to 60°C |
| Rated Power | 3800W |
| Machine Size | 50×50×93 cm |
| Net Weight | 160 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: Can the Hot Pressing Bonding Machine bond glass to glass or glass to plastic?
A: Yes. The Jiutu Hot Pressing Bonding Machine can bond glass to glass and glass to plastic using vacuum thermocompression. It is suitable for optical bonding of display cover glass, bonding of rigid plastic chips (PMMA, PC, PP, COP, COC, BOPET), and microfluidic device assembly. The vacuum environment ensures a bubble-free, high-strength bond.
Q2: How long does a typical bonding cycle take with the Hot Pressing Bonding Machine?
A: Bonding cycle time depends on the material. For Flexdym polymer, the machine can complete molding in as little as 2 minutes. For rigid plastic chips such as PMMA and PC, the cycle typically takes a few minutes depending on the required temperature and pressure settings. The precise PLC control system allows operators to program and repeat bonding parameters consistently.