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Flip Chip Bonding Machine — ACF Pulse Hot Press Bonder
Jiutu 9TU-M039A Flip Chip Bonding Machine uses ACF glue process with pulse heating to bond flip chips, FPC, and FFC cables to substrates. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone chip bonding, medical, and R&D applications.
Main Features:
● Pulse heating — precise temperature control for flip chip bonding
● 45# steel main structure — high precision and stability
● Japanese SMC cylinder + precision pressure regulating valve
● Imported thermal insulation module and tungsten steel cutter head
● HD auxiliary alignment camera system
● Platform pre-heating function
| P/N | 9TU-M039A |
| Heating Method | Pulse heating |
| Working Temperature | 0°C to 500°C |
| Rated Power | 2500W |
| Machine Size | 64×55×57 cm |
| Net Weight | 85 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What is flip chip bonding and how does this machine support it?
A: Flip chip bonding is a method of connecting a semiconductor chip directly to a substrate by flipping it face-down and bonding the chip’s contact pads directly to the substrate pads. The Jiutu Flip Chip Bonding Machine uses ACF (Anisotropic Conductive Film) with pulse heating to create reliable electrical connections between the flipped chip and the substrate. The HD camera alignment system ensures precise positioning of the chip contacts before bonding.
Q2: What is the alignment accuracy of the Flip Chip Bonding Machine?
A: The Jiutu Flip Chip Bonding Machine features an HD auxiliary alignment camera system that can be positioned up or down and configured with different lens magnifications based on customer samples. The main structure is made of 45# steel for high precision and stability, and the Japanese SMC cylinder with precision pressure regulating valve ensures consistent, repeatable pressing force for accurate flip chip bonding results.