• Jiutu 9TU-M039A Pulse Heat Press Machine with HD alignment camera and pulse heating for precise ACF/FPC bonding
  • Pulse Heat Press Machine - Phone Repair Tools Machine Parts
  • Pulse Heat Press Machine
  • Pulse Heat Press Machine - Phone Repair Tools Machine Parts
  • Pulse Heat Press Machine - Phone Repair Tools Machine Parts
  • Pulse Heat Press Machine - Phone Repair Tools Machine Parts
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JiuTu Machine

Pulse Heat Press Machine

Pulse Heat Press Machine

$13,300.00 USD
$13,300.00 USD $13,300.00 USD
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Pulse Heat Press Machine — ACF/FPC Bonding Machine

Jiutu 9TU-M039A Pulse Heat Press Machine uses pulse heating and ACF glue process to bond chips, FPC, and FFC cables. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone cable binding, medical, and R&D applications.

Main Features:

● Pulse heating — rapid, precise temperature control

● 45# steel main structure — high precision and stability

● Japanese SMC cylinder + precision pressure regulating valve

● Imported thermal insulation module and tungsten steel cutter head

● HD auxiliary alignment camera system

● Platform pre-heating function

P/N 9TU-M039A
Heating Method Pulse heating
Working Temperature 0°C to 500°C
Rated Power 2500W
Machine Size 64×55×57 cm
Net Weight 85 kg
Working Pressure 0.4–0.8 MPa
Voltage 220V 50Hz

Frequently Asked Questions

Q1: How does the Pulse Heat Press Machine bond FPC cables to display panels?

A: The Jiutu Pulse Heat Press Machine places ACF (Anisotropic Conductive Film) between the FPC cable and the display panel contact pads. The machine then applies a precisely controlled pulse of heat (0–500°C) and pressure (0–0.6 MPa) through the tungsten steel cutter head. The ACF conductive particles are hot-pressed and burst, creating vertical electrical connections between the FPC and display panel while the adhesive bonds the components mechanically.

Q2: Is the Pulse Heat Press Machine suitable for laboratory research and development use?

A: Yes. The Jiutu Pulse Heat Press Machine is used in laboratory R&D environments in addition to production settings. Its precise, independently adjustable temperature and pressure parameters make it ideal for testing new bonding processes, evaluating different ACF adhesive types, and developing bonding parameters for new component designs. The HD camera alignment system also supports precise positioning for prototype and small-batch R&D work.

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Frequently Asked Questions

What are the main applications of the Pulse Heat Press Machine?
The Pulse Heat Press Machine is primarily used for bonding chips, FPC, and FFC cables, especially in mobile phone cable binding, medical devices, and research and development applications. Its precise heating and pressure control ensure reliable bonding in these fields.
What features make the Pulse Heat Press Machine suitable for precise bonding tasks?
This machine features pulse heating for rapid, accurate temperature control, a high-precision HD alignment camera system, and a tungsten steel cutter head. These features allow for accurate positioning and bonding of delicate electronic components.
Can I customize the cutter head on the Pulse Heat Press Machine?
Yes, the cutter head is customizable up to 90×5mm, allowing you to adapt the machine for different component sizes and bonding needs, enhancing its versatility for various applications.
What are the technical specifications of the Pulse Heat Press Machine?
The machine has a working temperature range of 0–500°C, operates at 220V 50Hz, with a rated power of 2500W, and a working pressure between 0.4–0.8 MPa. Its size is 64×55×57 cm, and it weighs 85 kg.
How does the HD auxiliary alignment camera assist in bonding processes?
The HD alignment camera helps in precisely positioning components by providing a clear visual aid during the bonding process. This ensures accurate placement and improves the quality and consistency of your bonding results.