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Pulse Heat Press Machine — ACF/FPC Bonding Machine
Jiutu 9TU-M039A Pulse Heat Press Machine uses pulse heating and ACF glue process to bond chips, FPC, and FFC cables. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone cable binding, medical, and R&D applications.
Main Features:
● Pulse heating — rapid, precise temperature control
● 45# steel main structure — high precision and stability
● Japanese SMC cylinder + precision pressure regulating valve
● Imported thermal insulation module and tungsten steel cutter head
● HD auxiliary alignment camera system
● Platform pre-heating function
| P/N | 9TU-M039A |
| Heating Method | Pulse heating |
| Working Temperature | 0°C to 500°C |
| Rated Power | 2500W |
| Machine Size | 64×55×57 cm |
| Net Weight | 85 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: How does the Pulse Heat Press Machine bond FPC cables to display panels?
A: The Jiutu Pulse Heat Press Machine places ACF (Anisotropic Conductive Film) between the FPC cable and the display panel contact pads. The machine then applies a precisely controlled pulse of heat (0–500°C) and pressure (0–0.6 MPa) through the tungsten steel cutter head. The ACF conductive particles are hot-pressed and burst, creating vertical electrical connections between the FPC and display panel while the adhesive bonds the components mechanically.
Q2: Is the Pulse Heat Press Machine suitable for laboratory research and development use?
A: Yes. The Jiutu Pulse Heat Press Machine is used in laboratory R&D environments in addition to production settings. Its precise, independently adjustable temperature and pressure parameters make it ideal for testing new bonding processes, evaluating different ACF adhesive types, and developing bonding parameters for new component designs. The HD camera alignment system also supports precise positioning for prototype and small-batch R&D work.