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Pulse Hot Press Machine — ACF/FPC Bonding Machine
Jiutu 9TU-M039A Pulse Hot Press Machine uses pulse heating and ACF glue process to bond chips, FPC, and FFC cables. Temperature 0–500°C, pressure 0–0.6 MPa. Cutter head customizable up to 90×5mm. HD alignment camera. Used in mobile phone cable binding, medical, and R&D applications.
Main Features:
● Pulse heating — rapid, precise temperature control
● 45# steel main structure — high precision and stability
● Japanese SMC cylinder + precision pressure regulating valve
● Imported thermal insulation module and tungsten steel cutter head
● HD auxiliary alignment camera system
● Platform pre-heating function
| P/N | 9TU-M039A |
| Heating Method | Pulse heating |
| Working Temperature | 0°C to 500°C |
| Rated Power | 2500W |
| Machine Size | 64×55×57 cm |
| Net Weight | 85 kg |
| Working Pressure | 0.4–0.8 MPa |
| Voltage | 220V 50Hz |
Frequently Asked Questions
Q1: What makes the Pulse Hot Press Machine more precise than a constant-heat press machine?
A: The Jiutu Pulse Hot Press Machine uses pulse heating, which rapidly heats the cutter head to the exact target temperature and immediately cools after the bonding cycle. This prevents heat accumulation and thermal drift that can occur with constant-heat machines. The result is more consistent bonding temperature across every cycle, reducing the risk of over-heating sensitive FPC cables or display components while maintaining reliable ACF bond quality.
Q2: Can the Pulse Hot Press Machine be used for both pre-bonding and main bonding steps?
A: Yes. The Jiutu Pulse Hot Press Machine supports both the pre-bonding (tacking) step and the main bonding step in the ACF bonding process. The platform pre-heating function warms the substrate before the main press, and the independently adjustable temperature and pressure parameters allow operators to set different profiles for each step, ensuring optimal ACF activation and bond strength for both stages.